Automotive Cockpit SoC Technology and Applications Research Report, 2022


Research Cockpit SoC: Local chip vendors are beginning to come to the fore, and who will rule the ten billion yuan market. Cockpit SoC is the computing power unit of smart cockpits.

New York, Feb 11. 2022 (GLOBE NEWSWIRE) — Announces Release of “Automotive Cockpit SoC Technology and Application Research Report, 2022” –
It is primarily responsible for the operation and processing of massive cockpit data, including multiple camera video access, network processing unit (NPU), on-board audio processing, speech rendering and output. and image (GPU/DPU) of multiple displays, in-car Bluetooth/WiFi connection and Ethernet data interaction with other main on-board ECUs (e.g. Central Gateway).

Cockpit SoC products with high computing power, multi-integration and powerful AI deliver ever better performance.

As smart cockpits gain ground, the main cockpit control SoC must not only meet the needs of multi-screen scenarios such as cluster, cockpit display and AR-HUD, but also to perform operations such as voice recognition and vehicle control. User experience indices of cockpit systems, such as response speed, startup time, and connection speed, directly determine whether an automotive brand is competitive or not. Smart cars have increasingly high demands on the performance and computing power of the cockpit SoC.

The CPU computing power of the cockpit SoC has improved significantly, from tens of KDMIPS in the past to over 100 KDMIPS now. At present, the CPU computing power of Qualcomm Snapdragon SA8155P is about 105KDMIPS, SA8195P is about 150KDMIPS, and the 4th generation SoC SA8295 automotive cockpit even up to more than 200KDMIPS. Among Chinese vendors, the CPU computing power of Huawei Kirin 990 exceeds 75KDMIPS; SemiDrive’s latest X9U cockpit chip features 100KDMIPS CPU computing power; Rockchip’s brand new RK3588M smart cockpit chip also offers 100KDMIPS CPU computing power.

The cockpit SoC’s AI computing power has also multiplied. In which, Samsung’s production Exynos Auto V910 SoC offers around 1.9TOPS AI computing power. According to Samsung’s plan, the NPU computing power of Exynos Auto V920, a cockpit chip that will be mass-produced around 2025, will reach about 30TOPS. Qualcomm’s production SA8155P chip offers AI computing power of around 8TOPS, and its fourth-generation cockpit SoC is integrated with NPU computing power of up to 30TOPS. Qualcomm plans to produce its Cockpit SoC product launched with the greatest AI computing power in 2023.

As for Chinese cockpit SoCs, SemiDrive’s cockpit products from mid-range to high-end are all integrated with AI computing power, of which X9U provides 1.2TOPS AI computing power; Rockchip’s latest RK3588M SoC cockpit provides 6TOPS AI computing power; the AI ​​computing power of Longying No.1, a cockpit chip of SiEngine Technology under Geely, is about 8TOPS.

In terms of the Cockpit SoC process, the 5nm process has come out. At present, 7nm and 8nm cockpit chips have been created, such as Qualcomm 8155/8195, Samsung V910 and Rockchip RK3588M. Additionally, Qualcomm introduced its latest 5nm chip, a 4th generation Snapdragon automotive cockpit platform, and plans to start mass production in 2023.

In the fierce competition of cockpit SoCs, foreign giants are making steady progress and Chinese suppliers are stepping up their efforts to produce chips.

Over the past two years, competition in the automotive cockpit SoC market has intensified, especially in the mid-range and high-end segments. Not only are there more competing companies, but also mainstream electronic chip players like Qualcomm, Intel, NVIDIA, Huawei, AMD, MediaTek are vigorous entrants, in addition to traditional automotive SoC vendors such as NXP, Renesas and TI. For example, in 2021, AMD entered the automotive cockpit market through Tesla. From the vehicle gaming scenario, AMD designed a smart cockpit SoC for Tesla carrying a consumer gaming graphics card.

Besides foreign chipmakers, Chinese chip companies such as AutoChips, SemiDrive, Rockchip, Horizon Robotics and SiEngine have also joined the battlefield as independent chip vendors, which is reshaping the pattern of the chip industry. automobiles. In 2021, local companies in China competed to introduce new self-developed products for a place in the cockpit SoC market.

In April 2021, SemiDrive unveiled X9U, a flagship cockpit SoC with total CPU computing power up to 100KDMIPS, 3D graphics performance up to 300GFLOPS and AI computing power up to 1.2TOPS. In December 2021, SiEngine, Geely’s automotive chip designer, launched Longying No.1, a 7nm smart cockpit chip that meets AEC-Q100 Grade 3 automotive standard. It is an equivalent of Qualcomm 8155 and is expected to be produced in quantity in the third quarter of 2022.

At the end of December 2021, Rockchip, a specialist in the design and development of AIoT processors, launched a range of automotive cockpit electronics, including automotive cockpit SoCs such as RK3358M, RK3568M and RK3588M, and bundled the RK809M and RK806M PMIC chips , which provide customers with high-, mid- and low-end cockpit chip solutions with different performance.

Rockchip’s flagship automotive cockpit, RK3588M SoC, adopts 8nm process and high-performance Octa-core CPU and GPU. With a CPU computing power of 100K DMIPS, a GPU computing power of 512GFLOPS and an NPU AI computing power of 6TOPS, this chip enables hybrid, quantitative and multi-model parallel computing. It provides AI processing capabilities comparable to high-end computer boxes and realizes functions such as single-core multi-screen.

In addition, in 2021, some foreign companies also launched new cockpit SoC products to stabilize or break through the market model. For example, in July 2021, Renesas introduced a new series of R-Car Gen3e SoCs, covering six new products, which apply to cockpit domain integrated control and other domains and are planned for mass production. in 2022; in November 2021, Samsung launched Exynos Auto V7, a new ASIL-B safety standard compliant SoC for mid to high-end intelligent cockpit systems, which was applied to the ICAS3.1 on-board computer of volkswagen

Cockpit SoC companies are flexibly adjusting their strategies to meet the evolving smart vehicle market amid supply chain rebuilding and business model change.

Chips need hardware and software to do their job. Software weighs more heavily in the vehicle market in the context of software-defined vehicles. In recent years, chip vendors have transformed from hardware vendors to service providers, that is, they are no longer just selling chip and hardware products, and have started to develop hardware + software or even complete system solutions.

Among them, Nvidia has deployed full protocol stacks. Nvidia, which only sold chips in the past, provides the full DRIVE IX protocol stack for cockpits in addition to the full DRIVE AV protocol stack for autonomous driving. DRIVE IX starts with Orin chips for autonomous driving, and also incorporates the previous Parker and Xavier.

In September 2021, Renesas unveiled the R-Car Software Development Kit (SDK), a complete software platform in a single package that enables faster and easier software development and validation for smart cameras. Renesas is also developing a cross-platform, reusable and scalable software platform.

Furthermore, as intelligent vehicles advance and software-defined vehicles arrive, automotive business models are changing drastically. In the future, users will care more about iteratively upgraded software services than conventional needs when buying a car. This also results in a change in the SoC supply relationship of the cockpit. OEMs not only need cockpit SoC vendors to provide original products, but also require them to meet customization needs and offer OEM or vendor compatible software features.

In the past, chips were exchanged with car manufacturers via Tier1, but now this indirect partnership is replaced by possibly direct cooperation between chip suppliers and OEMs. A new sourcing model where software and hardware are custom-built and co-developed has emerged.
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